Layer count reduction.
Blind and Buried via Designed out.
Via size increase.
Via count reduction.
Track and Gap increase.
Copper Balance.
Double sided Assembly to Single sided.
Balanced Designs for faster throughput.
Component type side balance.
Flexi rigid solutions to remove cable harnesses and assembly time.
Multiple board stacks on to single PCB.
Function test.
Clam Shell.
Single sided.
Boundary scan.
Resist misalignment problems.
Design out over or under etch.
Problem component footprint solutions.
Component mass balance.
Impedance control.
Track quality improvement - reduced track length and via count.
Interactive manual routing not Batch Autorouting.
We have the full suite of Pre and Post Layout Tools
- Hyperlynx LineSim and BoardSim.
Lower your
PCB Manufacturing costs